The MediaTek Dimensity 9500 is shaping up to be one of the most powerful mobile processors of 2025. Built on a cutting-edge 3nm process, it promises unmatched performance, advanced AI capabilities, and superior gaming experiences. Here’s a complete breakdown of its specs, features, and what to expect.
Fabrication and CPU Architecture
- 3nm TSMC N3P Node: Offers up to 10% better efficiency and 5% improved performance than the N3E process.
- Octa-core All Big-Core CPU:
- 1x Cortex-X930 “Travis” (Flagship core, >4.0 GHz)
- 3x Cortex-X9 “Alto” performance cores
- 4x Cortex-A7 “Gelas” cores for sustained loads
This high-performance core setup focuses entirely on speed, breaking away from traditional efficiency-focused designs.
Graphics and Gaming Power
- Immortalis-Drage GPU: Designed for ray tracing with improved thermal control.
- Enhanced Cache:
- 16MB L3 cache (up from 12MB)
- 10MB system-level cache (SLC)
- Memory Support:
- LPDDR5X RAM (up to 10,667 Mb/s)
- UFS 4.1 storage for faster app loading and file transfers
With this setup, the Dimensity 9500 promises smooth gaming, faster multitasking, and better visual performance.
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AI Capabilities
- Next-Gen NPU 9.0: Delivers up to 100 TOPS (Tera Operations Per Second) – double the AI processing power compared to Dimensity 9400.
- ARM SME (Scalable Matrix Extension): Enhances AI and machine learning performance.
- Supports on-device AI tasks, camera enhancements, voice recognition, and future GenAI applications.
Benchmark Performance
- AnTuTu Score: Surpasses 4 million points, outperforming Snapdragon 8 Gen 4 by approximately 17%.
- Geekbench: Expected single-core scores around 4,000 due to X930 clock speeds.
This makes it one of the fastest Android chipsets, rivaling both Qualcomm and Apple in early benchmarks.
Connectivity and Features
- 5G-ready with integrated modem
- Wi-Fi 7 and Bluetooth 5.4 support
- Improved ISP for enhanced camera performance and better low-light imaging
Launch Date and Availability
- Expected Launch: Q4 2025 (October–November)
- First Devices (Rumored):
- Vivo X300 Series
- OPPO Find X9
- Possibly Honor Magic 9
These flagship phones are expected to showcase the full power of the Dimensity 9500.
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MediaTek Dimensity 9500 – Specifications Table
| Feature | Details |
|---|---|
| Process | TSMC 3nm (N3P) |
| CPU Configuration | 1×X930 + 3×X9 + 4×A7 |
| Clock Speed | >4.0 GHz |
| GPU | Immortalis-Drage with Ray Tracing |
| RAM Support | LPDDR5X (10,667 Mb/s) |
| Storage Support | UFS 4.1 |
| AI NPU | 100 TOPS (NPU 9.0) |
| SME AI Support | Yes (ARM SME) |
| Connectivity | 5G, Wi-Fi 7, Bluetooth 5.4 |
| AnTuTu Benchmark | 4,000,000+ |
| Expected Launch | Q4 2025 |
| First Devices | Vivo X300, OPPO Find X9 |
Conclusion
The MediaTek Dimensity 9500 aims to dominate the Android chipset space in 2025 with its groundbreaking 3nm architecture, massive AI upgrade, and elite gaming GPU. With benchmark scores already beating key rivals and strong OEM support expected, this chipset is a serious contender in the flagship segment. Stay tuned with Bloom Pakistan
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